REAR SURFACE JOINING METHOD OF SEMICONDUCTOR CHIP FOR THERMAL CONDUCTION AND SEMICONDUCTOR DEVICE USING IT,申请号JP19900099595-传众专利搜索

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发明名称	REAR SURFACE JOINING METHOD OF SEMICONDUCTOR CHIP FOR THERMAL CONDUCTION AND SEMICONDUCTOR DEVICE USING IT
摘要
申请公布号	JPH03296237(A)	申请公布日期	1991.12.26
申请号	JP19900099595	申请日期	1990.04.16
申请人	HITACHI LTD;HITACHI VLSI ENG CORP	发明人	AKASAKI HIROSHI
分类号	H01L21/60;H01L23/12	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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