| 摘要 |
<p>PURPOSE: To shorten test time and to reduce cost on a semiconductor substrate supporting plural integrated circuits, providing a means connecting the electrode of an integrated circuit to that of the other integrated circuit together, so that an integrated circuit test performed, while the integrated circuit is supported on the semiconductor substrate is simplified for decreased test proves. CONSTITUTION: A semiconductor substrate 12, plural integrated circuits 13, which with each circuit comprising at least one electrode, are supported with the substrate 12, and a means which is arranged on the substrate 12 connects the electrode of one circuit of plural integrated circuits 13 to that of another circuit on the plural integrated circuits 13 together, are provided. For example, on the semiconductor substrate 12 of GaAs which supports plural monolithic microwave integrated circuits 13, lattice-like conductors 17a-17c assigned in a longitudinal direction and lattice-like conductors 23a-23c assigned in a lateral direction are provided. In addition, a conductive region 15 of metal or doped semiconductor, which is assigned between common gate pads 14a-14c of each integrated circuit 13 and the conductors 17a-17c assigned in longitudinal direction, while being electrically connected to them, is provided.</p> |
