Semiconductor device package assembly employing flexible tape

摘要

A flexdible film substrate carries a pattern of conductive leads and mounting pads. The conductive leads have outer lead portions, and inner lead portions which terminate near to the mounting pads. Semiconductor chips are mounted face-up on the mounting pads and connected by wire-bond connections to the inner lead portions. A transfer molding process is used to encapsulate the semiconductor device assemblies leaving the outer lead portions protruding from the encapsulated material. The flexible film substrate supports the mounting pads and conductive leads during the wire-bonding and transfer molding operations.