| 摘要 |
PURPOSE:To prevent a wiring part from becoming thin and from being disconnected during the formation of the wiring part and to enhance a product yield and reliability by a method wherein a mask region for dummy wiring part use is installed in a mask to be used during the formation of the wiring part for a semiconductor device and a dummy wiring part is installed by using this mask in addition to an element wiring part which is used actually. CONSTITUTION:A dummy pattern 4 of chromium oxide is installed additionally on a mask 1; a dummy wiring part 8 corresponding to the pattern is installed also on a chip 5; a ratio of a wiring part to a chip area is increased from 2.5% to about 40%. As a result, an effect that a resist adheres to a side wall in order to prevent side etching of the wiring part during an etching operation is increased remarkably; a phenomenon that wiring parts 7, 8 become thin and are disconnected after the etching operation is not caused. |
