发明名称 |
METHOD OF MAKING MOLDS FOR ELECTRODEPOSITION FORMING OF MICROSTRUCTURED BODIES |
摘要 |
In a method of making molds with microstructured recesses having a continuous base covered by a film of an electrically conductive material for forming in the recesses, by electrodeposition, microstructured plate-like bodies a microstructure master mold is pressed into a layer of thermoplastic material coated with a film of an electrically conductive material at a temperature which is above the softening temperature of the thermoplastic material such that the thermoplastic material with the electrically conductive film thereon first contacts the microstructure face and then enters the recesses in the microstructure. The master mold and thermoplastic material are then cooled and the master mold is removed whereby the thermoplastic material provides a negative mold of the microstructure having a continuous electrically conductive film disposed on the recess bases whereas the remainder of the electrically conductive film is broken apart and disposed in isolated spangles on the rest of the microstructured mold. The microstructured negative mold is then ready for electrodeposition of a metal in the microstructure recesses using the electrically conductive film therein as an electrode.
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申请公布号 |
US5073237(A) |
申请公布日期 |
1991.12.17 |
申请号 |
US19910672421 |
申请日期 |
1991.03.20 |
申请人 |
KERNFORSCHUNGSZENTRUM KARLSRUHE GMBH |
发明人 |
BACHER, WALTER;BIEDERMANN, HANS;HARMENING, MICHAEL |
分类号 |
B29C33/38;B29C59/02;C25B11/03;C25D1/10 |
主分类号 |
B29C33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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