| 摘要 |
PURPOSE:To improve moisture resistance and bonding wire strength by forming a second wiring film into the same pattern configuration as that of a base film in a region narrower than a connection region of the bonding wire. CONSTITUTION:A second aluminum film 6 is etched and formed in such a man ner that it forms fine patterns spreaded in the same configuration as that of a plurality of fine rectangular patterns 2a spreaded at lattice positions in a narrower region than a connection region of a bonding wire 8 to be bonded. With such construction, a surface comprising the film 6 as a bonding pad forms an uneven fine dotted pattern. Accordingly, as the film 6 is connected to the bonding wire 8, the bonding wire 8 completely covers the film 6 for improvement of the moisture resistance of the film 6. Further, the film 6 is connected so as to bite the bonding wire 8, so that bonding strength is improved. |
