| 摘要 |
PURPOSE:To obtain a thermosetting resin composition desirable as a heat- resistant electrical insulation material of a low dielectric constant by mixing a fluorocyanamide compound with a fluoromaleimide compound. CONSTITUTION:A thermosetting resin composition is obtained by mixing a cyanamide compound of formula I (wherein Rf is a bifunctional group having at least one aromatic ring and at least one fluoropropylene group) {e.g. 2,2- bis[4-(4-cyanamidophenoxyl)phenyl]-1,1,1,3,3,3-hexafluoropropane} with a maleimide compound of formula II (wherein Rf is as defined above) {e.g. 2,2- bis[4-(4-maleimidophenoxyl)phenyl]-1,1,1,3,3,3-hexafluoropropane}. This composition contains fluorine atoms, therefore can effectively give a cured product of a low dielectric constant and is excellent in heat resistance and high- temperature mechanical properties, so that it is suitable as a molding material or an insulation material for electrical machines. |
