EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR PARTS

摘要

The epoxy resin compsn. for encapsulating semiconductor parts comprises: (A) 10-30 wt. pts. of the cresol novolak epoxy resin or phenol novolak epoxy resin of 170-240 epoxy equiv. and 60-110 deg.C softening temp.; (B) 5-20 wt. pts. the phenol novolak resin or cresol novolak resin of 70-110 deg.C softening temp. having two or more hydroxy gp. in the molecular; (C) 60-80 wt. pts. of inorganic filler; (D) 0.1-10 wt. pts. of the mixed silicone oil having hydrophilic gp. and hydrophobic gp. in the molecular chain; and (E) 0.1-5 wt. pts. of fume silica.