| 摘要 |
<p>PURPOSE:To enable chip-like electronic components to be densely mounted on the small area of a multilayered board and to be lessened in packaging height by a method wherein the stacked chip-like electronic components are mounted in a through-hole provided to the multilayered board by insertion. CONSTITUTION:Chip-like electronic components 16 and 17 are inserted into through-holes 11a, 12a, and 13a overlapping each other to be mounted. That is, the through-holes 11a and 12a which are larger than the electronic component 16 located inside and enable the component 17 to be inserted are provided to a first board 11 and a second board 12 respectively. The through-hole 13a which is smaller than the through-holes 11a and 12a and enables the component 17 to be inserted is provided to a third board 13. Furthermore, the electronic component 16 transferred by a film carrier 1 is cut off together with a frame lead 2 from the film carrier 1 and inserted into the through-hole 13a, and the frame lead 2 is outer lead-bonded to a conductor pattern 20 formed on the peripheral part of the through-hole 13a by soldering.</p> |
