| 摘要 |
<p>PURPOSE:To reduce the area of a slit, improve the utilization of material and realize cost reduction, by arranging a share cut part at a slit connection part connecting slits on the peripheral part of an outer lead of a semiconductor device. CONSTITUTION:The title lead frame is provided with the following; islands 7 for mounting chips, island suspensions 8 for retaining the islands 7 and fixing them to an outer frame 9, inner leads 5, outer leads 4, a tie bar 6 for retaining the inner leads 5 and the outer leads 4 and fixing them to the outer frame 9, and slits 1 arranged in a row in order to prevent the deformation of the outer leads 4. Between the slits 1, rectilinear share cut parts 3 are formed at slit connection parts 2 in order to connect the slits 1. When the above lead frame is resin-sealed, injection pressure of resin is applied between the tie bar 6 and the slit 1, but the share cut part 3 has a structure wherein the compression side is rigid and the tension side is cut off and becomes free. Thereby the pressure in this state is relieved in the vicinity of the share cut part 3, and the deformation of the outer lead 4 and the tie bar 6 can be prevented.</p> |
