| 摘要 |
PURPOSE:To provide a mechanism for detecting the fault of an inner conductor due to invasion of water on a semiconductor pellet and to monitor the fault by an external terminal by providing wirings along the outer periphery of the pellet between the bonding pad of the pellet and the edge of the pellet, and providing pads at both ends and midway of the wiring, etc. CONSTITUTION:A wiring 101 provided along the outer periphery of a pellet 100 between bonding pads 105 disposed along the periphery of a semiconductor pellet 100 and the periphery of the pellet 100, first and second pads 102, 103 formed at both ends of the wiring 101 to be wire bonded, arbitrary number of third pads 104 not wire bonded to arbitrary positions on the way of the wiring 101, and an insulating film 106 formed with openings on the pads 105, the first, second and third pads 102-104 to cover the pellet 100 are provided. Thus, states of conductor corrosion, fault in a package can be externally detected by outer leads wire-connected to the first and second pads 102, 103. |
