| 摘要 |
Apparatus for improved processing of semiconductor wafers and the like has at least one processing bowl, a chemical supply for supplying a processing chemical to the processing bowl, and at least one processing head mounted for controlled movement between a processing position in which the processing head is in an operative relationship with the processing bowl to define a substantially enclosed processing chamber, and a loading position in which the processing head is removed from the processing bowl for loading or unloading wafers from the processing head. A wafer support detachably supports wafers and allows controlled motion of the wafer support and any wafer held therein, at least when the processing head is in the processing position. The apparatus also includes a second processing chamber and a wafer transfer for moving wafers to and from the processing bowl, and to and from said second processing chamber. <IMAGE> |
