| 摘要 |
<p>PURPOSE:To easily obtain a desired mounting circuit unit at a low cost by heating and pressing to mold an electronic part to be mounted as placed on the prescribed surface of a printed circuit board having a thermoplastic resin plate as a base material and provided with a required circuit pattern, penetrating and connecting the projected lead pin of the electronic part to be mounted and integrating the electronic part to be mounted and the surface of the printed circuit board by fusion. CONSTITUTION:An electronic part 1 to be mounted is located to be positioned in the prescribed surface of a printed circuit board 6 having a thermoplastic resin 6a as a base material and provided with a required circuit pattern 6b. Then, the electronic part 1 and the printed circuit board 6 are heated and pressed to be molded as the electronic part 1 is located to be positioned in the prescribed surface of the printed circuit board 6. By thus molding by heating and pressuring, a lead pin 4 projected from the molded resin layer 5 of the electronic part 1 to be mounted is penetrated into and connected to the corresponding connecting pad 6b region of the printed circuit board 6 and the molded resin layer 5 of the electronic part 1 to be mounted is softened and integrally fused with the similarly softened surface of the printed circuit board 6.</p> |
