发明名称 MOLDING METHOD OF SANDWICH STRUCTURE
摘要 <p>PURPOSE:To heighten the strength of a molded object by a method in which the temper ature of a mold is regulated by the flow of warm water through a thermostatic hole, whereby the fluidity of raw liquid is raised, and before the raw liquid is solidified by reaction and molds a molded object, the desired position to be strengthened of the molded object is cooled by the flow of cooling a medium through a cooling hole, thereby molding a skin layer thick. CONSTITUTION:A cooling hole 7 is bored at the corner part 5b of the top force 5A which molds the corner part of the recessed part of a molded object. The inner diameters and the positions of the cooling hole 7 and the hole 8 for temperature- regulation are determined by the various factors of the temperature, conducted heat amount, specific heat and heat conductivity of the resin poured in a mold cavity 4 and the material of the top force 5A etc. The mold-temperature in the time when the raw liquids of two kinds are poured into the mold cavity 4, is regulated by causing the warm water of 40-45 deg.C to flow through a thermostatic hole 8. Before the raw liquids of two kinds poured into the mold cavity 4 is solidified by reaction and molds a molded object, the cooling medium cooled to about -5 - +10 deg.C by liquid nitrogen gas or Freon gas etc. is caused to pass the cooling hole 7 and cools the raw liquid in the mold cavity 4 adjacent to the cooling hole 7, whereby the skin layer with high density and desired thickness is molded, and its strength is improved.</p>
申请公布号 JPH03272824(A) 申请公布日期 1991.12.04
申请号 JP19900284222 申请日期 1990.10.24
申请人 HITACHI LTD 发明人 GOTO MASAO;NAKAMURA SHOZO;WARATANI KENICHI;YOKONO ATARU;AOKI MASAYOSHI;SHIBATA KATSUO;NAKA REIJI
分类号 B32B27/08;B29C33/04;B29C39/26;B29C39/38;B29C45/16;B29C45/72;B29C45/73;B29K105/04;B29L9/00;B32B37/15 主分类号 B32B27/08
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