| 摘要 |
PURPOSE:To enable reliable wire bonding by providing friction means on the wall of a wire guide groove for keeping wire faced with an electrode. CONSTITUTION:A bonding tool 3 is used to keep bonding wire 4 faced with an electrode, and it has a guide groove 32 with steps. Because of such a groove structure, appropriate friction can be maintained between the wire and the guide groove in the case of a lighter load applied on the wire. As a result, the vibration of the bonding tool 3 is transmitted to the wire supplied through the guide groove. Therefore, wire is firmly bonded to an electrode without damage to the chip. |
