| 摘要 |
<p>PURPOSE:To convey a wafer without being exposed to the contamination with dust particles by a method wherein air is blown along a conveyance frame from sidewalls of the conveyance frame on which edge frames erected on both sides are formed, a high-performance filter is installed so as to cover its air layer and a transfer means of the wafer levitated on the filter is installed. CONSTITUTION:Small holes 2 are made at definite intervals in sidewalls of edge frames 1 near the surface of a conveyance frame 3 on which the edge frames 1 are formed on both sides; clean air passing through a pipe 8 penetrating the edge frames 1 is blown to the surface of the conveyance frame 3 from the small holes 2. Since a high-performance filter 4 is installed on the whole surface so as to cover a blown air layer, the clean air is filled nearly equally over the whole surface anD is blown to the surface at a nearly even pressure by making a filter material 5 equivalent from holes in a punching plate 6. Consequently, wafers which are placed on the filter 4 are levitated slightly. When the blown clean air is given slight directivity, they are moved easily. When a device to tilt the conveyance frame 3 is installed, the wafers are slipped down and can be moved easily.</p> |
