| 摘要 |
PURPOSE:To enable the arrangement of an electrode pad at the central section of a chip, and to reduce a potential drop in the chip without increasing parasitic load capacity even in the chip for a large-scale LSI by forming a semiconductor device in the structure of lead frames having two layers and disposing one lead frame at a position oppositely faced to the chip. CONSTITUTION:A first lead frame 3 made of covar is bonded onto a package substrate 1 by glass 4 for sealing. The first lead frame 3 and an electrode pad 5 in the peripheral section of a chip 2 are connected electrically by the bonding wires 6 of aluminum wires. A second lead frame 8 is fixed onto the first lead frame 3 through glass 7 for sealing. The second lead frame 8 and an electrode pad 9 at the central section of the chip 2 are connected electrically by the bonding wires 10 of the aluminum wires. A ceramic package cap 12 bonded by glass 11 for sealing is positioned onto the second lead frame 8, thus sealing the chip 2 in an airtight manner. |
