发明名称 WAFER TREATMENT DEVICE
摘要 <p>PURPOSE:To enable a wafer to be aligned and its position to be detected in a short time by a providing a roller which contacts a lower peripheral edge of each stored wafer and can be rotated and by providing a pair of detection elements consisting of a light-projecting element and a light-receiving element which are provided at a position which is engaged to a peripheral part of each stored wafer, corresponding to a specified number of stored wafers. CONSTITUTION:A retaining member 2 where each wafer 1 is placed, a roller 10 which allows the wafer in contact with a lower peripheral edge thereof to be lifted, and to be rotated, a light-projecting part 34 which emits light to each wafer 1 which is provided within the retaining member 2, a detection part 30 which enables presence or absence of the wafer 1 to be detected by emitted light, and a signal processing part 40 which outputs a state of a wafer arrangement according to this detection part output are provided. Thus, the presence or absence of the wafer and its position can be collectively detected instantly by shutting off or reflecting light which is projected from the light-projecting element 34 by each aligned wafer 1 and by detecting in a signal processer 40 a change in quantity of light of the light-receiving element 30 which receives this light, thus enabling the wafer 1 to be aligned and its position to be detected in a short time.</p>
申请公布号 JPH03270253(A) 申请公布日期 1991.12.02
申请号 JP19900071560 申请日期 1990.03.20
申请人 TOKYO ELECTRON SAGAMI LTD 发明人 ASANO TAKAYASU;ISHII KATSUMI
分类号 H01L21/68 主分类号 H01L21/68
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