| 摘要 |
<p>A mixture of 100 parts by weight of acrylated urethane oligomer, 50 to 60 parts by weight of hydroxypropylmethacrylate, 3.0 to 3.5 parts by weight of hydroxymethylphenylpropanone, 1.9 to 2.1 parts by weight of 1,1-bis(t-butylperoxy)cyclohexane and 11 to 12 parts by weight of amorphous silica filler provides a composition curable by exposure to ultraviolet radiation which is post curable by heating. The compositions are storable in a single package and are useful for coating and encapsulating electronic components, such as printed wire boards. Articles of poly(phenylene)sulfide and the cured composition are useful for military electronic applications. These articles can also be overcoated with parylene.</p> |
