发明名称 SOLVENT-FREE CONTACT ADHESIVE
摘要 Moisture-curing, melt-applied polyurethane contact adhesive composition comprising a mixture of at least two polyether-based polyurethane prepolymers prepared from a low-molecular weight polyether (MW less than 1000) and a high-molecular weight polyether (MW greater than 1000) together with polyisocyanates, the mixture having an initial glass transition temperature in the range -5 DEG C to +10 DEG C and when applied as a melt at a temperature between the melting point of the composition and 140 DEG C is effective as a contact adhesive after cooling to room temperature. Open times up to one hour are obtained.
申请公布号 ZA9009785(B) 申请公布日期 1991.11.27
申请号 ZA19900009785 申请日期 1990.12.05
申请人 BOSTIK LTD. 发明人 WALTER RATH;ELMAR DZIERZYNSKI
分类号 C08G18/12;C08G18/48;C09J175/00;C09J175/08 主分类号 C08G18/12
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