发明名称 STRUCTURE FOR SEMICONDUCTOR CHIP MOUNTING USE
摘要 PURPOSE:To prevent harmful oozing-out of resin into the gaps between conductive leads by a method wherein the gaps between the leads are respectively made to bend into a labyrinthine form by projecting parts formed integrally with the lead on at least one side of the leads adjacent to one another of a large number of conductive leads. CONSTITUTION:Projecting parts 16 and 17 to intrude into gaps 38 between both outer lead parts 9 of outer lead parts 9 adjacent to each other in the state of almost a right angle to the gaps 38 are formed on the individual outer lead parts 9. The projecting parts 17 on the inside are spaced apart a boundary P and the parts between these projecting parts 17 and the boundary P are used as resin reservoir parts 18. When lead patterns 3 are formed en bloc, the projecting parts 16 and 17 are simultaneously formed integrally with the individual outer lead parts 9. Accordingly, the gaps 38 between the outer lead parts 9 are formed into bent parts 15 made to bend into a labyrinthine form by the projecting parts 16 and 17. Thereby, flowing-out resin 39 are stopped from oozing out lengthily in the directions of the points of the individual outer lead parts 9 in the gaps 38 between the outer lead parts 9.
申请公布号 JPH03266442(A) 申请公布日期 1991.11.27
申请号 JP19900065289 申请日期 1990.03.15
申请人 NIPPON STEEL CORP 发明人 OHIGATA NAOHARU;YAMAMOTO TOSHIO;KAMIYA MITSUMASA;IMADA MASAFUMI
分类号 H01L21/60;H01L21/56;H01L23/28;H01L23/495 主分类号 H01L21/60
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