发明名称 |
MOUNTING OF SAW DEVICES |
摘要 |
A SAW device is formed by applying metallized areas (11) to a surface of a SAW substrate (10) and attaching conductive leads (18) to the metallized areas. The substrate is inverted and located on a hybrid circuit so that the leads (18) contact and are supported on conductive areas (30) of the circuit. This mounting arrangement minimizes the stresses which occur in the substrate in its operational life. A novel shape for the device is also disclosed. |
申请公布号 |
EP0156502(B1) |
申请公布日期 |
1991.11.27 |
申请号 |
EP19850301141 |
申请日期 |
1985.02.20 |
申请人 |
BRITISH TELECOMMUNICATIONS PUBLIC LIMITED COMPANY |
发明人 |
ROGERSON, STEPHEN PAUL;MACDONALD, BRIAN MICHAEL |
分类号 |
H03H3/08;H03H9/05;H03H9/25 |
主分类号 |
H03H3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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