| 摘要 |
PURPOSE:To arrange that an electromagnetic-wave noise generated at an operation is not diffused to the circumference by a method wherein the outer circumference of a semiconductor device is covered with a conductor and the covered conductor is connected electrically to a reference potential. CONSTITUTION:A plastic 2 used to seal a semiconductor chip 1 and to mold an outer shape, external terminals 3 used to feed a power supply and to input/ output signals and a metal foil 4 used to shield electromagnetic waves are formed. The circumference of the plastic 2 is fixed by using an adhesive so as not to come into contact with the external terminals 3. A board face 7 used to mount components and a ground pattern 5 of a board are formed; and a conductive adhesive 6 electrically connects the metal foil 4 to the ground pattern 5 of the board. Generally, a semiconductor device is fixed to the board by using an adhesive, and a soldering operation is executed in a reflow furnace or the like. Only by using the conductive adhesive as an adhesive for this operation, the metal foil 4 can be connected electrically to the ground pattern 5 of the board and the semiconductor device can simply be mounted. |
