THIN FILM BONDING METHOD AND APPARATUS HAVING STRUCTURE FOR REMOVING WETTING AGENTS

摘要

A thin film bonding method and apparatus having structure for removing wetting agents applied to a thin film and base plate that are to be bonded by pressure and heat. A spray or rollers (30) apply the wetting agent prior to the initial bonding of a leading edge of the thin film to a leading edge of the base plate. A pressure roller (15) applies heat and pressure to the film and base plate, bonding them together as the roller rotates and drives the plate toward a cleaning position. Suction and agent removal rollers (80) are used to remove the residual excess agent from the bonded film and the pressure roller. The removal rollers are joined together by a link mechanism that has a spring bias and is operation by a gear mechanism that provides a wiping action.