| 摘要 |
<p>In a method for processing an integrated circuit of the type having conductive die bond pads thereon the fabricated IC is coated with a layer of photoresist (16) which is exposed to create a pattern which includes windows (18-29) over the pads and a connection between at least two of the pads. The exposed photoresist is dissolved and the exposed portions are plated with gold to a depth sufficient for creating a bump over each die bond pad suitable for bonding a conductive lead thereto. The remaining photoresist is dissolved thus leaving a plurality of bumps for attaching conductive leads thereto and an electrical connection (24, 26, 28) between at least two of the bumps. <IMAGE></p> |
