| 摘要 |
An electrically heated soldering iron which is particularly adapted for surface mounting components on printed circuit boards. A unitary member rotatably joins together a pair of channel-shaped arms and resiliently biases the arms in a normally open position which is defined by a pair of overlapping members in the center portion of the iron. The arms are selectively moveable by a user toward each other to a closed position and the channel portions of the arms are adapted to retain the unitary member, the pair of overlapping members, and detachable assemblies of U-shaped soldering tips for applying heat to surface mounted electronic components. The U-shaped soldering tips are comprised of dissimilar conductors joined together to unitarily provide a soldering tip, heating element for heating the tip and a thermocouple for sensing the temperature of the tip.
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