| 摘要 |
PURPOSE:To position plural sheets of inner layer boards accurately by boring a reference hole for positioning at a specified position, and driving a rivet made of thermoplastic resin so as to fix the inner layer boards with a prepreg. CONSTITUTION:Two sheets of inner layer plates, where wiring patterns are made on both sides of obverses and reverses, are laminated with a prepreg 2a between, and a reference hole is bored in the specified position. A rivet 4 is driven in the reference hole so as to fix the inner layer plates 1 and the prepreg 2a. The top of the rivet 4 driven in the reference hole is widened by an ultrasonic staking so as to calk the inner layer plates 1 and the prepreg 2a, and then prepregs 2b are laid upon the other, and further an outer layer copper foil 3 is laid upon the outside, and those are integrated by heating and pressing, thus a multilayer wiring board is manufactured. |
