| 摘要 |
PURPOSE:To discolor the outer layer copper foil surface part corresponding to the upper layer of the nonetching zone of an inner layer circuit board so as to make the pattern in the inner nonetching zone from the shade on the surface of an outer layer copper foil by polishing the surface of the outer layer copper foil provided on the surface of a laminate. CONSTITUTION:A material laminate is used, which is obtained by laying one or more inner layer circuit boards 5, where circuit patterns are formed beforehand on one side or both sides, and two or more prepregs 3 and 4 on top of the other alternately, and further laying outer layer copper foils on both sides or one side of the laminate, and then heating and pressing them for molding. By applying polishing operation onto the surface of the outer layer copper of said material laminate, the surface of the outer layer copper on the inside inner layer nonetching zone is discolored. Hereby, the position of the inner layer circuit 5 is directly indicated on the surface of the outer layer of the laminate, and also the reference hole mark provided inside and the cutting line can be indicated as a nonetching zone A or an etching zone B. |
