| 摘要 |
PURPOSE:To improve an assembly performance of a semiconductor device and adapt the device to a multi-pin type multi-chip package by intersecting an extended line of an arbitrary side of a chip with one side of a lead frame which directly faces this side or an extended line of the lead frame or more specifically installing the chip to a die pad of this chip so that both sides may be parallel with each other. CONSTITUTION:Since two chips installed to a lead frame are square-shaped, a die pad 2 of the lead frame which supports the chips is also square-shaped. Bonding pads are uniformly and regularly laid out on the chips. The longer axis of the lead frame and the central axis of each die pad form an angle of 45 deg. respectively. The mating angles of the die pads are combined and each side of the die pads on opposite sides face each other, forming the angle of 90 deg.. Both sides on opposite sides resemble like falling on each opposite side. Furthermore, since the die pads are shaped on the slant, an intermediate lead 5 extending from the vicinity of one side of the die pad 2 falls slantingly to the edge of the lead frame virtually without bending. |
