| 摘要 |
PURPOSE:To improve heat resistance and heat dissipation by integrating a laminate wherein a resin layer is arranged at each upside and/or downside of a required number of inner layer materials where circuits are made, and inorganic cover composition layers are arranged at the outermost sides through a thermosetting resin primer. CONSTITUTION:A laminate, wherein a resin layer is arranged at each upside and/or downside of a required number of circuits are made, and an inorganic cover composition layers are arranged at the outermost sides through a thermosetting resin primer, is integrated. The resin layer arranged at the upside and/or downside of the inner layer material, the application layer of resin, the base material impregnated with resin, or the like is used. Moreover, the thermosetting resin primer is alkyletherified melamine resin, phenol resin, or the like. Hereby, heat resistance and heat dissipation improve. |
