| 发明名称 |
ELECTROPLATED SEMI-PRODUCT FOR COINS, MEDALS AND STAMPS AND METHOD OF THEIR MANUFACTURE |
| 摘要 |
An electroplated blank is disclosed capable of having insignia minted on at least one face to form coins, medallions or tokens, the blank comprising a metallic core e.g. of steel, with an electroplated coating comprising 0.5 to 8% by weight tin, the balance copper, completely enveloping said blank and having a thickness of from about 5 mu m to about 50 mu m. |
| 申请公布号 |
CS9100802(A2) |
申请公布日期 |
1991.11.12 |
| 申请号 |
CS19910000802 |
申请日期 |
1991.03.26 |
| 申请人 |
SHERRITT GORDON LIMITED,CA |
发明人 |
YASUDA MITSUHIRO,CA;RUSCOE MICHAEL JOHN HARVEY,CA;LEE ALLAN H.,CA |
| 分类号 |
C25D3/58;A44C21/00;B32B15/01;C22C9/02;C25D5/34;C25D5/50;C25D7/00;G07F1/06;(IPC1-7):B32B15/01 |
主分类号 |
C25D3/58 |
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