发明名称 |
Method of packaging microwave semiconductor components and integrated circuits |
摘要 |
Integration and packaging of monolithic microwave integrated circuits (MMIC) components is facilitated by using a motherboard comprising high resistivity silicon, which having a thermal conductivity three times that of gallium arsenide. Ultra high purity, uncompensated silicon preferably is used. Anisotropic etching of recesses in the motherboard facilitates precise placement of the MMICs in the recesses, enabling use of automated die and wire bonding techniques to reduce required assembly time substantially. Using a silicon motherboard also ultimately enables incorporation of required control circuitry. The silicon motherboard also transmits RF energy well, a useful characteristic particularly in C-band and X-band applications in which microstrip is used, though other transmission media function well at even higher frequencies.
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申请公布号 |
US5063177(A) |
申请公布日期 |
1991.11.05 |
申请号 |
US19900592750 |
申请日期 |
1990.10.04 |
申请人 |
COMSAT |
发明人 |
GELLER, BERNARD D.;TYLER, JOHANN U.;HOLDEMAN, LOUIS B.;PHELLEPS, FRED R.;LAIRD, III, GEORGE F. |
分类号 |
H01L23/14;H01L23/66 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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