| 摘要 |
PURPOSE:To divide a bonding pad feed material and to obtain desired bonding pads by a method wherein a solder layer is provided on one surface of an Al layer via an easily solderable metal plating layer and the bonding pad feed material consisting of these layers are divided into strips having a width equal with that of the desired bonding pads. CONSTITUTION:In a bonding pad feed material 10, an easily solderable metal plating layer 12 is applied on one surface of an Al layer 11 and a solder layer 13 is applied thereon. The feed material 10 consisting of these layers has a width and a height, which are equal with those of a desired bonding pad material. Desirably, notches 14 are provided in the material 10 at intervals equal to the length of a desired bonding pad so that it is convenient that the material 10 is conformed to the length of the desired bonding pad and is divided.
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