Highly integrated circuit repair procedure,申请号DE19904014008-传众专利搜索

发明名称	Highly integrated circuit repair procedure
摘要	The pattern of conductors on the surface of a chip is altered for redundancy or repair by applying an electron beam sensitive lacquer coating and an electron beam is guided according to a program to make the required adjustment. The treated areas are then etched. @(4pp Dwg.No.0/0)
申请公布号	DE4014008(A1)	申请公布日期	1991.10.31
申请号	DE19904014008	申请日期	1990.04.27
申请人	AKADEMIE DER WISSENSCHAFTEN DER DDR, O-1086 BERLIN, DE	发明人	TEMMLER, DIETMAR, DR.-ING.;WINKLER, WOLFGANG, DIPL.-ING. DR., O-1200 FRANKFURT, DE;PAESCH, KLAUS-DETLEF, DIPL.-ING., O-8020 DRESDEN, DE;LAUCHE, JUERGEN, DR.RER.NAT., O-8010 DRESDEN, DE
分类号	H01L21/768;H01L23/525	主分类号	H01L21/768
代理机构		代理人
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