| 摘要 |
PURPOSE:To evaluate the pass/fail of soldered parts by measuring the data of the heights of the soldered parts, and obtaining the amounts of changes in height data on a board, the soldered parts and parts. CONSTITUTION:The entire surface of a printed board 101 is scanned with laser light. The reflected and scattered light from the board 101 is guided to a posi tion detecting element 112 with a reflecting mirror 110. The condensing position of the scattered light on the element 112, which is not fixed because of the irregularities of the height on the board, is detected. Then, the height data of the mounted parts and the soldered parts on the board are operated with an image operating means 114. Thereafter, a correlation-accumulation operating means 115 computes the difference values of the height data only within the mask data from a mask memory means 117 which is provided at the position of the soldered part. Then, the number of the data within the regions of the good products and the defective products is computed in correlation wherein the height data and the difference value are two variables. The height data in each region are accumulated and added. Then, the computed 115 data and predetermined reference value are compared for every mask data in a judging means 116. Thus the quality of the soldered state is judged. |
