| 摘要 |
PURPOSE:To prevent occurrence of cracks in the ceramic multilayer interconnection board by providing a polyimide layer with via holes connected with the land section on the first land section of the ceramic board and the second land section, and then, brazing pins for outside connection. CONSTITUTION:A first land section 1-4 to be connected with through holes 1-3 filled with a conductive material is formed on the surface of a ceramic multilayer interconnection board 1-1. Then a polyimide resin layer 1-5 with via holes 1-9 connected with the first land section 1-4 is formed on the board 1-1 and land section 1-4. After the layer 1-5, a second land section 1-6 is formed on the surface of the layer 1-5 so as to cover the via holes 1-9. Finally, pins 1-8 for outside connection are connected onto the second land section 1-6 with a brazing material 1-7. |
