| 摘要 |
A probe device for measuring the electric characteristics of an IC chip on a wafer, etc. is disclosed. The probe device includes a unit having a micro-strip line structure in which a plurality of probes are integrally formed. The unit comprises a flexible insulating quartz base plate, a plurality of mutually insulated lead strips provided on one surface of the base plate, and a ground strip provided on the other surface of the base plate. Notches are formed in those regions of the insulating base plate, which are located between the lead strips at an end portion of the unit. The unit is supported such that the tip end portion of the unit is formed as a free-end portion and the unit is inclined by a predetermined angle toward electrode pads on the IC chip with respect to an imaginary horizontal plane. The combination of each of the lead strip, the insulating quartz base plate and the ground strip constitute a micro-strip line. At the tip end portion of the unit, each micro-strip line serves as the probe. A tip portion of each lead strip serves as a contact of the probe.
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