发明名称 SEMICONDUCTOR WAFER CARRIER DEVICE
摘要 <p>PURPOSE:To dispense with a transfer device by laying an endless nail carrying path along processing modules and arranging I/O stations between the treatment modules. CONSTITUTION:An endless rail type carrying path 21 of OHS (Over Head Shattle) system laid along processing modules A1 to H8 in a matrix arrangement employs a crossing looped system with solid crossing sections. Therefore, a carrier can take an arbitrary path among processing modules A1 to H8. A carrier is carried only by delivery by I/O stations 10A to 10H between each of treatment modules A1 to H8 and OHS method caterpillar-shaped carrier path 21 and travelling on the OHS system endless rail carrying path 21. Thereby, it is possible to omit a transfer device, to reduce a time required for carrying and to improve carrying ability.</p>
申请公布号 JPH03242952(A) 申请公布日期 1991.10.29
申请号 JP19900038475 申请日期 1990.02.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 KANEDAKI YUKIMICHI
分类号 B65G37/00;B65G47/52;H01L21/677;H01L21/68;H05K13/02 主分类号 B65G37/00
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