发明名称 |
Integrated circuit chip interconnect |
摘要 |
An integrated circuit chip interconnect combining tape automated bonding techniques and conventional wire bonding and adapted to communicate by wire bonding leads to the maximum number of terminal leads for a given chip size, and to accommodate a variety of different chips by the same configuration, the interconnect allowing individual testing of each chip prior to the interconnect's mounting in a multichip module.
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申请公布号 |
US5061988(A) |
申请公布日期 |
1991.10.29 |
申请号 |
US19900559668 |
申请日期 |
1990.07.30 |
申请人 |
MCDONNELL DOUGLAS CORPORATION |
发明人 |
RECTOR, STEVE |
分类号 |
H01L21/66;H01L23/498;H01L23/538;H01L23/58 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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