| 摘要 |
PURPOSE:To prevent change in lead pitch and a lead from being removed from the lead row due to lifting of the lead by supporting the lead tip row of leads protruding in a row with a coupling body for a semiconductor device. CONSTITUTION:A semiconductor device 1 consists of a package 2 consisting of a rectangular insulating resin and a plurality of leads 3 consisting of a metal body protruding in parallel from four sides of a peripheral surface of this package 2. After this lead 3 is extended slightly in horizontal direction from the package 2, it is extended downward and is further extended in horizontal direction in the shape of wings of a sea-gull. Then, a horizontal part of that tip becomes a packaging edge 4 and a coupling body 9 is mounted to a packaging edge 4 at the tip of this lead 32, thus preventing lead deformation and lead pitch deviation caused by reduction in mechanical strength of lead due to reduction in lead pitch accompanying multiple pins of lead caused by reinforced structure of the lead 3 and hence the coupling body 9 of the lead tip row. |
