发明名称 THERMOSETTING CYANATO RESIN COMPOSITION AND ELECTRONIC MATERIAL CONTAINING SAME
摘要 PURPOSE:To obtain a low-permittivity insulation material excellent in heat resistance and useful for electronic materials by forming a three-dimensionally crosslinkable and curable material containing a specified cyanato compound as an essential component. CONSTITUTION:A three-dimensionally crosslinkable and curable material such as an ethylenically unsaturated compound, an epoxy compound, a phenol/ formaldehyde condensate, a melamine compound or an N-substituted unsaturated imide compound containing a cyanato compound of the formula (wherein n is 1 or 2, m is 0-(6-n); X is halogen, 1-10C alkyl, fluoroalkyl, alkoxy or fluoroalkoxy) e.g. 1,4-bis(1,1,1,3,3,3-hexafluoro-2-cyanatoisopropyl)benzene as an essential component is used as a thermosetting resin composition used as an electronic material such as a laminating material for printed circuit boards, an interluminary insulation material for semiconductors or a cable coating material.
申请公布号 JPH03239724(A) 申请公布日期 1991.10.25
申请号 JP19900036075 申请日期 1990.02.19
申请人 HITACHI LTD 发明人 NAGAI AKIRA;NISHIMURA SHIN;SUZUKI MASAHIRO;SUZUKI MASAO;KATAGIRI JUNICHI;TAKAHASHI AKIO;KOBI AKIO
分类号 C08J5/24;C08G73/06;C08L79/00 主分类号 C08J5/24
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