发明名称 PROTECTIVE PACKAGE FILM OF ELECTRONIC PRODUCT
摘要 PURPOSE: To prevent obstruction with static electricity and high frequency waves by furnishing particles of silica-contenting material whose surfaces are covered with a two-dimensional meshing structure of a specific antimony- containing tin oxide fine-crystals and a coating consisting of a heat sealing thermoplastic material at least on one surface of base films, where the particles are arranged so that a specific surface resistivity is established. CONSTITUTION: At least one of surface of the base film 11/13 is coated with at least one layer of latex or a heat sealing thermoplastic material, and at least one of the layers 21 and 23 of thermoplastic material function as matrix to bear the selected conductive particles. The conductive particles are of micron size of silica-containing material whose surfaces are coated dispersed in the matrix so that with a two-dimensional meshing structure of antimony-containing tin oxide fine-crystals, wherein the antimony content ranges from 1 to 30wt.%, and the dispersed in the matrix so that a cost film having a surface resistivity of approx. 10<12>Ω/sq. unit or below is obtained. Thereby electronic components can be protected from the electrostatic discharge, electrostatic field force, high frequency interference, and damage caused by water/moisture and corrosive gas.
申请公布号 JPH03233896(A) 申请公布日期 1991.10.17
申请号 JP19900276121 申请日期 1990.10.15
申请人 E I DU PONT DE NEMOURS & CO 发明人 RARUFU KUROSUBII GORIKE;FUAA FUEN FUAN;HAAMINIO SEFUERINO REBATSUTO
分类号 B65D85/86;B32B7/02;B32B9/00;B32B27/18;B65D65/40;B65D73/02;B65D81/24;B65D85/00;H01L23/552;H01L23/60;H05F1/02 主分类号 B65D85/86
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