| 摘要 |
PURPOSE:To execute a wire bonding operation surely without having a bad influence such as damage or the like on an IC chip by a method wherein the tip of a wire together with a wire ball is bonded to a bonding position on a substrate and the wire is bonded to a wire ball on a bonding position on the IC chip. CONSTITUTION:Only a wire ball is bonded to a bonding position on an IC chip; after that, a bonding operation is executed on the side of a substrate 1; after that, a bonding operation is executed on the surface of a chip 2 via a wire ball 5' which has been applied and formed in a state that a pressure force is not exerted directly by a capillary jig 3. As a result, a pressure from the side of a wire 4 or the tip of the capillary jig 3 is not exerted directly on the face of the IC chip 2; the face of the IC chip 2 is not damaged. Thereby, a wire bonding operation can be executed surely at a required bonding strength without having a bad influence such as damage or the like on the IC chip 2. |
