发明名称 |
ELECTRONIC DEVICE PACKAGE MOUNTING ASSEMBLY |
摘要 |
A unitary clip having a base portion and a stake end is used to attach an electronic device package to a heat sink. The stake end of the clip is secured within an aperture such as a groove or slot in the face of the heat sink and connected to the base by a curved spring portion. An electronic device package inserted between the base portion and the heat sink is urged into intimate contact with the surface of the heat sink. |
申请公布号 |
GB2243026(A) |
申请公布日期 |
1991.10.16 |
申请号 |
GB19910004535 |
申请日期 |
1991.03.04 |
申请人 |
* THERMALLOY INCORPORATED |
发明人 |
DONALD L * BLAND;MATTHEW C * SMITHERS |
分类号 |
H01L23/40 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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