| 摘要 |
A package for a heat generating, high voltage hybrid circuit is disclosed which comprises a package housing having a sidewall structure formed from an electrically insulative, thermally conductive ceramic material that obviates the need for using separate insulator structures between the sidewalls of the package and the electrical feedthroughs which afford electrical access to the circuit contained within the package housing. The feedthroughs include a layer of hardenable material for sealingly mounting a terminal connector through the sidewalls of the package. In one embodiment of the invention, the hardenable material sealingly mounts the terminal connectors of the electrical feedthroughs within circular openings in the sidewall structure. In another embodiment, the terminal connectors of the electrical feedthroughs include flat sections formed from copper directly deposited in recesses located within a ceramic frame disposed between the sidewall structure and the base of the package, and the hardenable material sealingly mounts the lower edge of the wall section over the upper surface of the ceramic frame. Both embodiments provide increased voltage and current carrying capacity in a package structure which is more reliable in operation.
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