| 摘要 |
PURPOSE:To easily and effectively cover the inner wall of a through hole with a substantially uniform plating layer by varying the atmospheric pressure of a plating solution containing tank periodically to a reduced pressure state and a pressurized state exceeding a normal pressure. CONSTITUTION:A basket 7 in which a plurality of printed circuit boards 1 to be plated in through holes are mounted in an electrolessly plating solution container 5 to be supported, is contained and dipped in electroless copper-plating solution 4, and pressurizing and discharging means 6 is driven to perform predetermined electroless plating. Plating reaction gas generated by the plating is easily and effectively removed by repeating periodic pressure reduced and increased states in the container 5 by the means 6. |
