| 摘要 |
PURPOSE:To enable the leakage of cooling water to be easily avoided in a simple structure by a method wherein a cooling bottom plate and a cooling plate cover are made in disc shape while a sealing groove is made circular. CONSTITUTION:Within the title curing device of resist for semiconductor composed of a cooling device mounted on the outer wall of a lamp chamber internally containing an ultraviolet ray lamp while the cooling device is composed of a cooling bottom plate 22 taking a U type sectional shape whereto cooling water is fed, a cooling cover 21 fixed on the opening side of said bottom plate 22 as well as a sealing ring 23 inserted into a sealing groove 24 on the opening side, said bottom plate 22 and cover 21 are made in disc shape while the sealing groove 24 are made circular. Through these procedures, all three parts of cooling plate cover 21, the cooling bottom plate 22 including the sealing groove 24 can be lathe-machined making the processing flaw circular not to be formed in the radial direction. Accordingly, the title resist curing device in simple structure capable of voiding the external leakage of the cooling water can be manufactured. |
