发明名称 |
METHOD OF FABRICATING MULTILAYER CIRCUIT STRUCTURES |
摘要 |
METHOD OF FABRICATING MULTILAYER CIRCUIT STRUCTURES An improved method of fabricating thick film dielectrics and copper conductors comprises depositing and drying an appropriate thick-film ink, treating the resulting patterned layer with a carbon dioxide plasma until substantially all of the organic vehicle is removed therefrom and then firing the layer in an inert atmosphere. In an alternate embodiment, a dried dielectric ink is initially treated with an oxygen plasma until about 75 to 99 percent of the vehicle is removed. Multilayer copper-based circuit structures fabricated utilizing the subject method are characterized by excellent integrity of the dielectric layers. |
申请公布号 |
CA1290201(C) |
申请公布日期 |
1991.10.08 |
申请号 |
CA19880561726 |
申请日期 |
1988.03.17 |
申请人 |
PINCH, HARRY L. |
发明人 |
PINCH, HARRY L.;THALER, BARRY J. |
分类号 |
C09D5/25;H01L21/48;H05K1/03;H05K1/09;H05K3/12;H05K3/46 |
主分类号 |
C09D5/25 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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