| 摘要 |
PURPOSE: To enable depositing of various metals in a wide range to a thin film surface by forming a first photoresist layer, into which water does not penetrate, on the surface of a material deteriorated by water, forming a second photoresist layer for treating on the first layer using water as a base, and removing part of both the layers and treating uncovered portion of the surface. CONSTITUTION: On the surface of a thin film 10a consisting of a material deteriorated by water, a first layer 12 composed of a first photoresist material not penetrated by water is formed, a second layer 14 is formed on the first layer 12, and this second layer is constituted with an ordinary water base photoresist. Then, the layers 12 and 14 are treated, and a desired portion on the surface 10a is partially removed so as to make a desired portion in an uncovered state. In this case, the treatment of the photoresist layer 14 by a solution, based on water will not give adverse effects on a surface 10a because of a non-aqueous penetrating photoresist layer 12 being interposed. Next, the exposed portion of the surface 10a will have a pattern in the predetermined portion formed by using layers 12, 14 as treatment mask. Finally, the layers 12, 14 are removed by a non-aqueous solvent. In this way, an effective treatment technique for sticking metals to the surface of a thin film can be obtained at a low cost. |
