发明名称 DICING METHOD
摘要 <p>PURPOSE:To prevent charge and contamination be using a salt of a compound of acid radical and ammonia acid radical as a solute of aqueous solution used for cooling dicing blade or cooling a cut section of a wafer. CONSTITUTION:A salt of a compound of acid radical and ammonia acid radical is used as a solute to be mixed into water 4 and 4' for cooling a dicing blade 1 or cooling a cut section of a wafer 2. The salt used herein can make aqueous solution 4 and 4' substantially neutral and is a solute capable of providing a high electric conductance which does not produce static electricity during ejection and does not contaminate wafers. This construction makes it possible to protect an Al exposed part on the wafer from damage, increase electric conductance to a satisfactory extent, prevent charge, inhibit electrostatic breakdown, and prevent the contamination of wafers produced by alkali metal ions.</p>
申请公布号 JPH03227556(A) 申请公布日期 1991.10.08
申请号 JP19900022487 申请日期 1990.02.01
申请人 FUJITSU LTD 发明人 OMURA MASAYOSHI;WATANABE YOSHIHARU
分类号 H01L21/301;H01L21/78 主分类号 H01L21/301
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